MT58LC128K32B3S27BWC2-9 vs MC80464K32L-12 feature comparison

MT58LC128K32B3S27BWC2-9 Micron Technology Inc

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MC80464K32L-12 MoSys Inc

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer MICRON TECHNOLOGY INC MOSYS INC
Package Description DIE, QFP,
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 9 ns 9 ns
JESD-30 Code X-XUUC-N94 R-PQFP-G100
Memory Density 4194304 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1
Number of Terminals 94 100
Number of Words 131072 words 65536 words
Number of Words Code 128000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX32 64KX32
Output Characteristics 3-STATE
Output Enable YES
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE QFP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER QUAD
Base Number Matches 1 1
Part Package Code QFP
Pin Count 100

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Compare MC80464K32L-12 with alternatives