MT58L32L32PT-6
vs
TC55V1325FF-7
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
TOSHIBA CORP
Part Package Code
QFP
QFP
Package Description
PLASTIC, TQFP-100
14 X 20 MM, 1.6 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100
Pin Count
100
100
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
Factory Lead Time
4 Weeks
Access Time-Max
3.5 ns
7 ns
Additional Feature
PIPELINED ARCHITECTURE
SYNCHRONOUS SELF-TIMED WRITE
Clock Frequency-Max (fCLK)
166 MHz
I/O Type
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
e0
Length
20 mm
20 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX32
32KX32
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.7 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.34 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
3.1 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
3
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MT58L32L32PT-6 with alternatives
Compare TC55V1325FF-7 with alternatives