TC55V1325FF-7 vs MT58L32L32FT-8.5 feature comparison

TC55V1325FF-7 Toshiba America Electronic Components

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MT58L32L32FT-8.5 Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code QFP QFP
Package Description 14 X 20 MM, 1.6 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100 LQFP,
Pin Count 100 100
Reach Compliance Code unknown unknown
Access Time-Max 7 ns 8.5 ns
Additional Feature SYNCHRONOUS SELF-TIMED WRITE
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm 20 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX32 32KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.1 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 3
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Moisture Sensitivity Level 3

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Compare MT58L32L32FT-8.5 with alternatives