MT55L256V32PB-7.5Z vs GS78132AGB-12 feature comparison

MT55L256V32PB-7.5Z Micron Technology Inc

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GS78132AGB-12 GSI Technology

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 119 119
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 4.4 ns 12 ns
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e1 e1
Length 22 mm 22 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type ZBT SRAM STANDARD SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX32 256KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.99 mm
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Factory Lead Time 29 Weeks
Additional Feature THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT.
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260

Compare MT55L256V32PB-7.5Z with alternatives

Compare GS78132AGB-12 with alternatives