GS78132AGB-12
vs
GS78132AB-12I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
119
119
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
29 Weeks
29 Weeks
Access Time-Max
12 ns
12 ns
Additional Feature
THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT.
THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT.
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e1
e0
Length
22 mm
22 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
32
32
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX32
256KX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.99 mm
1.99 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Compare GS78132AGB-12 with alternatives
Compare GS78132AB-12I with alternatives