MT55L128L36P1T-10IT
vs
CY7C1350F-133AC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
PLASTIC, MS-026BHA, TQFP-100
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Pin Count
100
100
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5 ns
4 ns
Clock Frequency-Max (fCLK)
100 MHz
133 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
e0
Length
20 mm
20 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX36
128KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP100,.63X.87
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.01 A
0.04 A
Standby Voltage-Min
3.14 V
3.14 V
Supply Current-Max
0.3 mA
0.225 mA
Supply Voltage-Max (Vsup)
3.465 V
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
2
1
Additional Feature
PIPELINED ARCHITECTURE
Moisture Sensitivity Level
3
Compare MT55L128L36P1T-10IT with alternatives
Compare CY7C1350F-133AC with alternatives