MT53C1K18B2EJ-25
vs
SN74ACT7801-20FN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICRON TECHNOLOGY INC
ROCHESTER ELECTRONICS LLC
Part Package Code
LCC
LCC
Package Description
PLASTIC, LCC-68
PLASTIC, LCC-68
Pin Count
68
68
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
25 ns
20 ns
Additional Feature
RETRANSMIT
Clock Frequency-Max (fCLK)
40 MHz
Cycle Time
25 ns
35.09 ns
JESD-30 Code
S-PQCC-J68
S-PQCC-J68
JESD-609 Code
e0
Length
24.23 mm
24.23 mm
Memory Density
18432 bit
18432 bit
Memory IC Type
OTHER FIFO
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1KX18
1KX18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
5.08 mm
4.57 mm
Standby Current-Max
0.005 A
Supply Current-Max
0.2 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
COPPER
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
24.23 mm
24.23 mm
Base Number Matches
1
2
Moisture Sensitivity Level
3
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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