MT53C1K18B2EJ-25 vs LH54V0235HU-25 feature comparison

MT53C1K18B2EJ-25 Micron Technology Inc

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LH54V0235HU-25 Sharp Corp

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SHARP CORP
Part Package Code LCC
Package Description PLASTIC, LCC-68 0.950 INCH, PLASTIC, LCC-68
Pin Count 68
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 25 ns 17 ns
Additional Feature RETRANSMIT
Clock Frequency-Max (fCLK) 40 MHz
Cycle Time 25 ns 25 ns
JESD-30 Code S-PQCC-J68 S-PQCC-J68
JESD-609 Code e0 e0
Length 24.23 mm 24.1808 mm
Memory Density 18432 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 1024 words 2048 words
Number of Words Code 1000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1KX18 2KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC68,1.0SQ LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.57 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.2 mA 0.19 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 24.23 mm 24.1808 mm
Base Number Matches 1 1
Parallel/Serial PARALLEL

Compare MT53C1K18B2EJ-25 with alternatives

Compare LH54V0235HU-25 with alternatives