MT4LSDT864LHIY-133XX
vs
HB56SW864DBK-7
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
HITACHI LTD
Part Package Code
MODULE
MODULE
Package Description
LEAD FREE, SODIMM-144
DIMM, DIMM144,32
Pin Count
144
144
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
SINGLE BANK PAGE BURST
FAST PAGE WITH EDO
Access Time-Max
5.4 ns
70 ns
Additional Feature
AUTO/SELF REFRESH
JESD-30 Code
R-XDMA-N144
R-XDMA-N144
JESD-609 Code
e4
Memory Density
536870912 bit
536870912 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
EDO DRAM MODULE
Memory Width
64
64
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
8MX64
8MX64
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Self Refresh
YES
NO
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIMM144,32
Refresh Cycles
4096
Standby Current-Max
0.032 A
Supply Current-Max
1.2 mA
Terminal Pitch
0.8 mm
Compare MT4LSDT864LHIY-133XX with alternatives
Compare HB56SW864DBK-7 with alternatives