MT49H8M36CFM-5IT vs MT49H8M36CBM-5 feature comparison

MT49H8M36CFM-5IT Micron Technology Inc

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MT49H8M36CBM-5 Micron Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description MICRO, BGA-144 LEAD FREE, MICRO, BGA-144
Pin Count 144 144
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 0.5 ns 0.5 ns
Additional Feature AUTO REFRESH AUTO REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
JESD-609 Code e0 e1
Length 18.5 mm 18.5 mm
Memory Density 301989888 bit 301989888 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 36 36
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX36 8MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.93 mm 0.93 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD SILVER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 1 2
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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