MT48LC16M16A2P-6AL
vs
MT48LC16M16A2FG-6AL
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Contact Manufacturer
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Package Description |
TSOP, TSOP54,.46,32
|
FBGA, BGA54,9X9,32
|
| Reach Compliance Code |
compliant
|
compliant
|
| Access Time-Max |
5.4 ns
|
5.4 ns
|
| Clock Frequency-Max (fCLK) |
167 MHz
|
167 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| Interleaved Burst Length |
1,2,4,8
|
1,2,4,8
|
| JESD-30 Code |
R-PDSO-G54
|
S-PBGA-B54
|
| JESD-609 Code |
e3
|
|
| Memory Density |
268435456 bit
|
268435456 bit
|
| Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
54
|
54
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
16MX16
|
16MX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP
|
FBGA
|
| Package Equivalence Code |
TSOP54,.46,32
|
BGA54,9X9,32
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
235
|
| Power Supplies |
3.3 V
|
3.3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
8192
|
8192
|
| Sequential Burst Length |
1,2,4,8,FP
|
1,2,4,8,FP
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MT48LC16M16A2P-6AL with alternatives
Compare MT48LC16M16A2FG-6AL with alternatives