MT47H64M16NF-25EAIT:M
vs
IS43DR16640C-25DBLI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICRON TECHNOLOGY INC
INTEGRATED SILICON SOLUTION INC
Package Description
TFBGA,
TFBGA, BGA84,9X15,32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Category CO2 Kg
12
12
Compliance Temperature Grade
Industrial: -40C to +95C
Industrial: -40C to +85C
EU RoHS Version
RoHS 2 (2015/863/EU)
RoHS 2 (2015/863/EU)
Candidate List Date
2023-06-14
2023-06-14
EFUP
e
e
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.12
CMRT V6.01
Qualifications
AEC-Q100
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
0.4 ns
0.4 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
400 MHz
400 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
4,8
4,8
JESD-30 Code
R-PBGA-B84
R-PBGA-B84
Length
12.5 mm
12.5 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR2 DRAM
DDR2 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
84
84
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
95 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64MX16
64MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA84,9X15,32
BGA84,9X15,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Refresh Cycles
8192
8192
Screening Level
AEC-Q100
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Sequential Burst Length
4,8
4,8
Standby Current-Max
0.01 A
0.025 A
Supply Current-Max
0.21 mA
0.28 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
8 mm
Base Number Matches
1
1
Factory Lead Time
10 Weeks, 1 Day
Samacsys Description
INTEGRATED SILICON SOLUTION (ISSI) - IS43DR16640C-25DBLI - DRAM, 64M X 16BIT, WBGA-84
Samacsys Manufacturer
Integrated Silicon Solution Inc.
Samacsys Modified On
2023-03-07 16:10:32
JESD-609 Code
e1
Moisture Sensitivity Level
3
Qualification Status
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Compare MT47H64M16NF-25EAIT:M with alternatives
Compare IS43DR16640C-25DBLI with alternatives