MT47H32M16CC-25EAT:B
vs
K4T1G164QE-HLF70
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA, BGA84,9X15,32
Pin Count
84
84
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
FOUR BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
0.4 ns
0.4 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B84
R-PBGA-B84
Length
12.5 mm
12.5 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR2 DRAM
DDR2 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
84
84
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
12 mm
7.5 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
400 MHz
I/O Type
COMMON
Interleaved Burst Length
4,8
Output Characteristics
3-STATE
Package Equivalence Code
BGA84,9X15,32
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Refresh Cycles
8192
Sequential Burst Length
4,8
Standby Current-Max
0.005 A
Supply Current-Max
0.2 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MT47H32M16CC-25EAT:B with alternatives
Compare K4T1G164QE-HLF70 with alternatives