MT46V32M16FN-75Z
vs
K4H511638C-ZCA2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
Package Description
10 X 12.50 MM, PLASTIC, FBGA-60
BGA, BGA60,9X12,40/32
Pin Count
60
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
0.75 ns
0.75 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
2,4,8
2,4,8
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e0
e3
Length
12.5 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
DDR1 DRAM
DDR1 DRAM
Memory Width
16
16
Number of Functions
1
Number of Ports
1
Number of Terminals
60
60
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32MX16
32MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
BGA
Package Equivalence Code
BGA60,9X12,40/32
BGA60,9X12,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Seated Height-Max
1.2 mm
Self Refresh
YES
Sequential Burst Length
2,4,8
2,4,8
Standby Current-Max
0.005 A
0.005 A
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10 mm
Base Number Matches
1
1
Pbfree Code
Moisture Sensitivity Level
1
Supply Current-Max
0.325 mA
Compare MT46V32M16FN-75Z with alternatives
Compare K4H511638C-ZCA2 with alternatives