MT46V32M16CY-5BXIT:J
vs
MT46V32M16FN-5BLIT:D
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Package Description
TBGA,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
0.7 ns
0.7 ns
Additional Feature
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e1
Length
12.5 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
DDR1 DRAM
DDR1 DRAM
Memory Width
16
16
Number of Functions
1
Number of Ports
1
Number of Terminals
60
60
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32MX16
32MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.2 mm
Self Refresh
YES
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.5 V
Supply Voltage-Nom (Vsup)
2.6 V
2.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8
Moisture Sensitivity Level
1
Output Characteristics
3-STATE
Package Equivalence Code
BGA60,9X12,40/32
Qualification Status
Not Qualified
Refresh Cycles
8192
Sequential Burst Length
2,4,8
Standby Current-Max
0.005 A
Supply Current-Max
0.48 mA
Compare MT46V32M16CY-5BXIT:J with alternatives
Compare MT46V32M16FN-5BLIT:D with alternatives