MT46H8M32LGB5-5AT:H
vs
K4M56323PG-FF900
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
10 X 13 MM, GREEN, PLASTIC, VFBGA-90
VFBGA, BGA90,9X15,32
Pin Count
90
90
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5 ns
7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B90
R-PBGA-B90
Memory Density
268435456 bit
268435456 bit
Memory IC Type
DDR DRAM
SYNCHRONOUS DRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
90
90
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
70 °C
Operating Temperature-Min
-40 °C
-25 °C
Organization
8MX32
8MX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Rohs Code
Clock Frequency-Max (fCLK)
111 MHz
I/O Type
COMMON
Interleaved Burst Length
1,2,4,8
Length
13 mm
Package Equivalence Code
BGA90,9X15,32
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Refresh Cycles
4096
Seated Height-Max
1 mm
Sequential Burst Length
1,2,4,8,FP
Standby Current-Max
0.0003 A
Supply Current-Max
0.14 mA
Terminal Pitch
0.8 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
Compare MT46H8M32LGB5-5AT:H with alternatives
Compare K4M56323PG-FF900 with alternatives