MT46H16M16LFBF-5AT:H
vs
V58C2128164SBLF6I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
PROMOS TECHNOLOGIES INC
Part Package Code
BGA
BGA
Package Description
BGA,
TBGA,
Pin Count
60
60
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5 ns
0.7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
Memory Density
268435456 bit
134217728 bit
Memory IC Type
DDR DRAM
DDR DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
16777216 words
8388608 words
Number of Words Code
16000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.95 V
2.7 V
Supply Voltage-Min (Vsup)
1.7 V
2.3 V
Supply Voltage-Nom (Vsup)
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Pbfree Code
Rohs Code
Length
13 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Terminal Pitch
1 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8 mm
Compare MT46H16M16LFBF-5AT:H with alternatives
Compare V58C2128164SBLF6I with alternatives