MT42L16M32D1AC-25AAT:A vs W979H2KBQX2I feature comparison

MT42L16M32D1AC-25AAT:A Micron Technology Inc

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W979H2KBQX2I Winbond Electronics Corp

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Package Description VFBGA, VFBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 5.5 ns
Additional Feature SELF REFRESH AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
JESD-30 Code R-PBGA-B134 S-PBGA-B168
JESD-609 Code e1
Length 11.5 mm 12 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type DDR DRAM LPDDR2 DRAM
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 134 168
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 16MX32 16MX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Seated Height-Max 1 mm 0.8 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.95 V 1.3 V
Supply Voltage-Min (Vsup) 1.7 V 1.14 V
Supply Voltage-Nom (Vsup) 1.8 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Width 10 mm 12 mm
Base Number Matches 1 1
Samacsys Manufacturer Winbond
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MT42L16M32D1AC-25AAT:A with alternatives

Compare W979H2KBQX2I with alternatives