W979H2KBQX2I vs EDB5432BEBH-1DAUT-F feature comparison

W979H2KBQX2I Winbond Electronics Corp

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EDB5432BEBH-1DAUT-F Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description VFBGA, VFBGA-134
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Samacsys Manufacturer Winbond
Access Mode FOUR BANK PAGE BURST SINGLE BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
JESD-30 Code S-PBGA-B168 R-PBGA-B134
Length 12 mm 11.5 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type LPDDR2 DRAM LPDDR2 DRAM
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 134
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX32 16MX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Seated Height-Max 0.8 mm 1 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.3 V 1.3 V
Supply Voltage-Min (Vsup) 1.14 V 1.14 V
Supply Voltage-Nom (Vsup) 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 12 mm 10 mm
Base Number Matches 1 1

Compare W979H2KBQX2I with alternatives

Compare EDB5432BEBH-1DAUT-F with alternatives