MT41K128M16HA-15E:D
vs
H5TQ2G63FFR-RDC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
SILICON360
SK HYNIX INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA, BGA96,9X16,32
Pin Count
96
96
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
Length
14 mm
13 mm
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
DDR3L DRAM
DDR3 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
96
96
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
128MX16
128MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.45 V
1.575 V
Supply Voltage-Min (Vsup)
1.283 V
1.425 V
Supply Voltage-Nom (Vsup)
1.35 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
9 mm
7.5 mm
Base Number Matches
2
1
Rohs Code
Samacsys Manufacturer
Hynix
Access Time-Max
0.195 ns
Clock Frequency-Max (fCLK)
933 MHz
I/O Type
COMMON
Interleaved Burst Length
4,8
Operating Temperature-Max
85 °C
Operating Temperature-Min
Output Characteristics
3-STATE
Package Equivalence Code
BGA96,9X16,32
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Refresh Cycles
8192
Sequential Burst Length
4,8
Standby Current-Max
0.012 A
Supply Current-Max
0.22 mA
Temperature Grade
OTHER
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MT41K128M16HA-15E:D with alternatives
Compare H5TQ2G63FFR-RDC with alternatives