MT40A256M16LY-062EAAT:B vs MT40A256M16GE-083E:B feature comparison

MT40A256M16LY-062EAAT:B Micron Technology Inc

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MT40A256M16GE-083E:B Micron Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 1600 MHz
I/O Type COMMON
Interleaved Burst Length 8
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 13.5 mm 14 mm
Memory Density 4294967296 bit 4294967296 bit
Memory IC Type DDR4 DRAM DDR DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 96 96
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256MX16 256MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Refresh Cycles 8192
Screening Level AEC-Q100
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Sequential Burst Length 8
Supply Voltage-Max (Vsup) 1.26 V 1.26 V
Supply Voltage-Min (Vsup) 1.14 V 1.14 V
Supply Voltage-Nom (Vsup) 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 7.5 mm 9 mm
Base Number Matches 1 1
Rohs Code Yes
Package Description FBGA-96
Samacsys Manufacturer Micron
Peak Reflow Temperature (Cel) NOT SPECIFIED
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MT40A256M16LY-062EAAT:B with alternatives

Compare MT40A256M16GE-083E:B with alternatives