MT29F8G08ABACAWP-IT:CTR
vs
MT29F8G08ABABAWP-AATX:B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Package Description
TSOP1, TSSOP48,.8,20
TSOP1, TSSOP48,.8,20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Data Retention Time-Min
10
10
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Length
18.4 mm
18.4 mm
Memory Density
8589934592 bit
8589934592 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1073741824 words
1073741824 words
Number of Words Code
1000000000
1000000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1GX8
1GX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Equivalence Code
TSSOP48,.8,20
TSSOP48,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Programming Voltage
3.3 V
3.3 V
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.0001 A
0.00005 A
Supply Current-Max
0.035 mA
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Type
SLC NAND TYPE
SLC NAND TYPE
Width
12 mm
12 mm
Write Protection
HARDWARE
HARDWARE
Base Number Matches
1
1
Rohs Code
Samacsys Manufacturer
Micron
Screening Level
AEC-Q100
Compare MT29F8G08ABACAWP-IT:CTR with alternatives
Compare MT29F8G08ABABAWP-AATX:B with alternatives