MT28C256532W18SFT-F705P85TTWT
vs
PF38F1030W0ZBQ0
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
FBGA-88
TFBGA, BGA88,8X12,32
Pin Count
88
88
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
85 ns
Additional Feature
CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH
CONTAINS 16 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH
JESD-30 Code
R-PBGA-B88
R-PBGA-B88
JESD-609 Code
e1
Length
12 mm
10 mm
Memory Density
134217728 bit
67108864 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+PSRAM
FLASH+PSRAM
Number of Functions
1
1
Number of Terminals
88
88
Number of Words
8388608 words
4194304 words
Number of Words Code
8000000
4000000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-25 °C
Organization
8MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TFBGA
Package Equivalence Code
BGA88,8X12,32
BGA88,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.2 mm
Standby Current-Max
0.00019 A
0.000005 A
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
9 mm
8 mm
Base Number Matches
1
1
Pbfree Code
Peak Reflow Temperature (Cel)
260
Supply Current-Max
0.055 mA
Time@Peak Reflow Temperature-Max (s)
30
Compare MT28C256532W18SFT-F705P85TTWT with alternatives
Compare PF38F1030W0ZBQ0 with alternatives