MT18HTF51272AZ-80EXX vs M393B4G70AH0-YF7 feature comparison

MT18HTF51272AZ-80EXX Micron Technology Inc

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M393B4G70AH0-YF7 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SAMSUNG SEMICONDUCTOR INC
Part Package Code DIMM DIMM
Package Description HALOGEN FREE, UDIMM-240 DIMM, DIMM240,40
Pin Count 240 240
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode DUAL BANK PAGE BURST FOUR BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX
JESD-30 Code R-XDMA-N240 R-XDMA-N240
Length 133.35 mm 133.35 mm
Memory Density 38654705664 bit 309237645312 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 240 240
Number of Words 536870912 words 4294967296 words
Number of Words Code 512000000 4000000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 512MX72 4GX72
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 30.5 mm 30.15 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.9 V 1.45 V
Supply Voltage-Min (Vsup) 1.7 V 1.2825 V
Supply Voltage-Nom (Vsup) 1.8 V 1.35 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1 mm 1 mm
Terminal Position DUAL DUAL
Width 30 mm 4 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Access Time-Max 0.4 ns
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIMM240,40
Peak Reflow Temperature (Cel) 260
Refresh Cycles 8192

Compare MT18HTF51272AZ-80EXX with alternatives

Compare M393B4G70AH0-YF7 with alternatives