MT16LSDT3264AG-10CXX vs IBM11N32645CB-60J feature comparison

MT16LSDT3264AG-10CXX Micron Technology Inc

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IBM11N32645CB-60J IBM

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC IBM MICROELECTRONICS
Package Description , DIMM, DIMM168
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode FOUR BANK PAGE BURST FAST PAGE WITH EDO
Access Time-Max 6 ns 60 ns
Additional Feature AUTO/SELF REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 Code R-XDMA-N168 R-XDMA-N168
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type SYNCHRONOUS DRAM MODULE EDO DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 168
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32MX64 32MX64
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified Not Qualified
Self Refresh YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1
Part Package Code DIMM
Pin Count 168
Alternate Memory Width 32
I/O Type COMMON
Output Characteristics 3-STATE
Package Code DIMM
Package Equivalence Code DIMM168
Refresh Cycles 4096
Seated Height-Max 50.8 mm
Standby Current-Max 0.032 A
Supply Current-Max 1.952 mA
Terminal Pitch 1.27 mm

Compare MT16LSDT3264AG-10CXX with alternatives

Compare IBM11N32645CB-60J with alternatives