MSP430FR5732IRGER
vs
MSP430FR5722IRGER
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
QFN
QFN
Package Description
HVQCCN, LCC24,.16SQ,20
HVQCCN, LCC24,.16SQ,20
Pin Count
24
24
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
16
16
Boundary Scan
NO
CPU Family
MSP430
MSP430
Clock Frequency-Max
24 MHz
24 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PQCC-N24
S-PQCC-N24
JESD-609 Code
e4
e4
Length
4 mm
4 mm
Moisture Sensitivity Level
2
2
Number of I/O Lines
17
17
Number of Terminals
24
24
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC24,.16SQ,20
LCC24,.16SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
1024
1024
ROM (words)
8192
8192
ROM Programmability
FRAM
FRAM
Seated Height-Max
1 mm
1 mm
Speed
24 MHz
24 MHz
Supply Current-Max
4.3 mA
2.8 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4 mm
4 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Compare MSP430FR5732IRGER with alternatives
Compare MSP430FR5722IRGER with alternatives