MSP430F5254IRGCT
vs
MSP430F5254IZQER
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
BGA
|
| Package Description |
HVQCCN,
|
,
|
| Pin Count |
64
|
80
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Has ADC |
YES
|
|
| Address Bus Width |
|
|
| Bit Size |
16
|
|
| CPU Family |
MSP430
|
|
| Clock Frequency-Max |
32 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N64
|
|
| JESD-609 Code |
e4
|
e1
|
| Length |
9 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
53
|
|
| Number of Terminals |
64
|
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVQCCN
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| RAM (bytes) |
32768
|
|
| RAM (words) |
32
|
|
| ROM (words) |
131072
|
131072
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
1 mm
|
|
| Speed |
32 MHz
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
9 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MSP430F5254IRGCT with alternatives
Compare MSP430F5254IZQER with alternatives