MSP1N5937BG vs BZX85C33RL feature comparison

MSP1N5937BG Microsemi Corporation

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BZX85C33RL Motorola Semiconductor Products

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MOTOROLA INC
Package Description O-LALF-W2 HERMETIC SEALED, GLASS, CASE 59-03, 2 PIN
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AL DO-41
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 33 V 33 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 6.06%
Working Test Current 11.4 mA 8 mA
Base Number Matches 1 5
Dynamic Impedance-Max 1000 Ω
Knee Impedance-Max 1000 Ω
Reverse Current-Max 0.5 µA

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