MSP1N5937BG vs BZX85C33 feature comparison

MSP1N5937BG Microsemi Corporation

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BZX85C33 Semtech Electronics Limited

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer MICROSEMI CORP SEMTECH ELECTRONICS LTD
Package Description O-LALF-W2
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AL DO-41
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.3 W
Qualification Status Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 33 V 33 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 6.06%
Working Test Current 11.4 mA 8 mA
Base Number Matches 1 31
Dynamic Impedance-Max 35 Ω
Knee Impedance-Max 1000 Ω
Reverse Current-Max 0.5 µA
Reverse Test Voltage 24 V

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