MSP1N5261C-1E3TR
vs
1N5261C-TAP
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
VISHAY SEMICONDUCTORS
Part Package Code
DO-35
DO-35
Package Description
O-LALF-W2
O-PALF-W2
Pin Count
2
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AH
DO-204AH
JESD-30 Code
O-LALF-W2
O-PALF-W2
JESD-609 Code
e3
e2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.48 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
47 V
47 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
Tin/Silver (Sn96.5Ag3.5)
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
2%
2%
Working Test Current
20 mA
2.7 mA
Base Number Matches
1
2
Pbfree Code
Yes
Dynamic Impedance-Max
105 Ω
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Reference Standard
AEC-Q101
Time@Peak Reflow Temperature-Max (s)
30
Compare MSP1N5261C-1E3TR with alternatives
Compare 1N5261C-TAP with alternatives