MSP1N5261C-1E3TR vs TC1N5261C.TR feature comparison

MSP1N5261C-1E3TR Microsemi Corporation

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TC1N5261C.TR Tak Cheong Electronics (Holdings) Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Part Package Code DO-35 DO-35
Package Description O-LALF-W2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e3 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 47 V 47 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish MATTE TIN TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 2% 2%
Working Test Current 20 mA 2.7 mA
Base Number Matches 1 1
Pbfree Code Yes
Dynamic Impedance-Max 105 Ω
Peak Reflow Temperature (Cel) 250

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