MSP1N4754AP
vs
1N4754AGE3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-41
Package Description
O-PALF-W2
DO-41, 2 PIN
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AL
DO-204AL
JESD-30 Code
O-PALF-W2
O-LALF-W2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Reference Standard
MIL-19500
MIL-STD-750
Reference Voltage-Nom
39 V
39 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
6.5 mA
6.5 mA
Base Number Matches
1
2
Factory Lead Time
14 Weeks
Samacsys Manufacturer
Microchip
Dynamic Impedance-Max
60 Ω
Knee Impedance-Max
1000 Ω
Reverse Current-Max
5 µA
Reverse Test Voltage
29.7 V
Compare MSP1N4754AP with alternatives
Compare 1N4754AGE3 with alternatives