MSM832GP-020 vs WS128K32-120HSM feature comparison

MSM832GP-020 Mosaic Semiconductor Inc

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WS128K32-120HSM White Electronic Designs Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOSAIC SEMICONDUCTOR INC WHITE ELECTRONIC DESIGNS CORP
Package Description , 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 120 ns
JESD-30 Code R-CDFP-F28 S-CPGA-P66
Memory Density 262144 bit 4194304 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 66
Number of Words 32768 words 524288 words
Number of Words Code 32000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8 512KX8
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form FLAT PIN/PEG
Terminal Position DUAL PERPENDICULAR
Base Number Matches 1 1
Rohs Code No
Additional Feature USER CONFIGURABLE AS 128K X 32
Alternate Memory Width 16
Length 30.1 mm
Package Code PGA
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 6.22 mm
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 30.1 mm

Compare MSM832GP-020 with alternatives

Compare WS128K32-120HSM with alternatives