MSM8128KXLMB-020
vs
CY7C1009-20DMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOSAIC SEMICONDUCTOR INC
CYPRESS SEMICONDUCTOR CORP
Package Description
,
0.300 INCH, CERDIP-32
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
20 ns
JESD-30 Code
R-CDIP-T32
R-GDIP-T32
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX8
128KX8
Output Enable
YES
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B (Modified)
MIL-STD-883 Class C
Standby Voltage-Min
2 V
4.5 V
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Rohs Code
Part Package Code
DIP
Pin Count
32
Additional Feature
AUTOMATIC POWER-DOWN
I/O Type
COMMON
JESD-609 Code
e0
Length
42.2275 mm
Output Characteristics
3-STATE
Package Equivalence Code
DIP32,.3
Seated Height-Max
5.08 mm
Standby Current-Max
0.002 A
Supply Current-Max
0.17 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare MSM8128KXLMB-020 with alternatives
Compare CY7C1009-20DMB with alternatives