MSM3764-20AS
vs
MB8264A-15-WZ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LAPIS SEMICONDUCTOR CO LTD
FUJITSU SEMICONDUCTOR AMERICA INC
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Time-Max
200 ns
150 ns
I/O Type
SEPARATE
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
PAGE MODE DRAM
PAGE MODE DRAM
Memory Width
1
1
Number of Terminals
16
16
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Temperature-Max
70 °C
110 °C
Operating Temperature-Min
-55 °C
Organization
64KX1
64KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
128
128
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
NMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Part Package Code
DIP
Pin Count
16
Access Mode
PAGE
Additional Feature
RAS ONLY/HIDDEN REFRESH
Length
19.585 mm
Number of Functions
1
Number of Ports
1
Operating Mode
ASYNCHRONOUS
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Width
7.62 mm
Compare MSM3764-20AS with alternatives
Compare MB8264A-15-WZ with alternatives