MB8264A-15-WZ
vs
MB8265-15Z
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
FUJITSU LTD
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
PAGE
Access Time-Max
150 ns
150 ns
Additional Feature
RAS ONLY/HIDDEN REFRESH
JESD-30 Code
R-GDIP-T16
R-XDIP-T16
Length
19.585 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
PAGE MODE DRAM
PAGE MODE DRAM
Memory Width
1
1
Number of Functions
1
Number of Ports
1
Number of Terminals
16
16
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
110 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
64KX1
64KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
128
128
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
MOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
2
Rohs Code
I/O Type
SEPARATE
JESD-609 Code
e0
Package Equivalence Code
DIP16,.3
Terminal Finish
Tin/Lead (Sn/Pb)
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