MB8264A-15-WZ
vs
MB8265-15Z
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FUJITSU SEMICONDUCTOR AMERICA INC
|
FUJITSU LTD
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
DIP, DIP16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Mode |
PAGE
|
|
| Access Time-Max |
150 ns
|
150 ns
|
| Additional Feature |
RAS ONLY/HIDDEN REFRESH
|
|
| JESD-30 Code |
R-GDIP-T16
|
R-XDIP-T16
|
| Length |
19.585 mm
|
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
PAGE MODE DRAM
|
PAGE MODE DRAM
|
| Memory Width |
1
|
1
|
| Number of Functions |
1
|
|
| Number of Ports |
1
|
|
| Number of Terminals |
16
|
16
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
110 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
64KX1
|
64KX1
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
128
|
128
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
NMOS
|
MOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| I/O Type |
|
SEPARATE
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP16,.3
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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