MSM27C2000-15AS
vs
AM27C020-150DIB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
OKI ELECTRIC INDUSTRY CO LTD
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
WDIP,
DIP, DIP32,.6
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
150 ns
150 ns
JESD-30 Code
R-GDIP-T32
R-CDIP-T32
Memory Density
2097152 bit
2097152 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX8
256KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
Supply Current-Max
0.005 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
1
Rohs Code
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
DIP32,.6
Standby Current-Max
0.0001 A
Terminal Finish
TIN LEAD
Compare MSM27C2000-15AS with alternatives
Compare AM27C020-150DIB with alternatives