AM27C020-150DIB
vs
M27C2001-15F1X
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
STMICROELECTRONICS
Reach Compliance Code
compliant
compliant
Base Number Matches
3
1
Rohs Code
Part Package Code
DIP
Package Description
WINDOWED, FRIT SEALED, CERAMIC, DIP-32
Pin Count
32
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
150 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T32
JESD-609 Code
e3
Length
41.885 mm
Memory Density
2097152 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
256KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.97 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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