MSC8144EVT1000A
vs
MSC8144EVT800B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
,
BGA,
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Barrel Shifter
NO
NO
Bit Size
32
Boundary Scan
YES
YES
Clock Frequency-Max
133 MHz
133 MHz
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B783
S-PBGA-B783
Length
29 mm
29 mm
Low Power Mode
YES
NO
Number of DMA Channels
16
Number of Serial I/Os
1
Number of Terminals
783
783
Number of Timers
4
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
90 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA783,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
RAM (words)
49152
ROM Programmability
FLASH
Seated Height-Max
3.176 mm
3.176 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.97 V
0.97 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
2
2
Rohs Code
Part Package Code
BGA
Pin Count
783
JESD-609 Code
e2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Terminal Finish
TIN SILVER
Time@Peak Reflow Temperature-Max (s)
30
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