MSC8144EVT800B
vs
MSC8144TVT800B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
BGA,
29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783
Pin Count
783
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Barrel Shifter
NO
NO
Boundary Scan
YES
YES
Clock Frequency-Max
133 MHz
133 MHz
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B783
S-PBGA-B783
JESD-609 Code
e2
Length
29 mm
29 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
3
Number of Terminals
783
783
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Seated Height-Max
3.176 mm
3.176 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.97 V
0.97 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
2
2
Samacsys Manufacturer
NXP
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