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MSA-0286-TR2 vs BGA2711,115 feature comparison

MSA-0286-TR2 Hewlett Packard Co

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BGA2711,115 NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer HEWLETT PACKARD CO NXP SEMICONDUCTORS
Package Description SL,4GW-LD,.085CIR PLASTIC, UMT6, SC-88, SOT-363, 6 PIN
Reach Compliance Code unknown compliant
Characteristic Impedance 50 Ω 50 Ω
Construction COMPONENT COMPONENT
Input Power-Max (CW) 13 dBm 10 dBm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 4 6
Operating Frequency-Max 2500 MHz 3600 MHz
Operating Frequency-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Equivalence Code SL,4GW-LD,.085CIR TSSOP6,.08
Power Supplies 5 V 5 V
RF/Microwave Device Type WIDE BAND LOW POWER WIDE BAND LOW POWER
Supply Current-Max 40 mA 16 mA
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
VSWR-Max 1.4
Base Number Matches 5 1
Rohs Code Yes
Part Package Code TSSOP
Pin Count 6
Manufacturer Package Code SOT363
HTS Code 8542.33.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Gain 13.9 dB
JESD-609 Code e3
Number of Functions 1
Terminal Finish Tin (Sn)
RF and Microwave » RF/Microwave Amplifiers
RF and Microwave » RF/Microwave Amplifiers

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Compare BGA2711,115 with alternatives