MRF8S19260HSR6
vs
MRF8S21200HSR6
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
ROHS COMPLIANT, CASE 375J-02, NI-1230S-8, 8 PIN
ROHS COMPLIANT, NI-1230S, CASE 375E-04, 4 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
8541.29.00.75
Factory Lead Time
4 Weeks
4 Weeks
Configuration
SEPARATE, 2 ELEMENTS
COMMON SOURCE, 2 ELEMENTS
DS Breakdown Voltage-Min
65 V
65 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
L BAND
S BAND
JESD-30 Code
R-CQFP-F8
R-CDFP-F4
Number of Elements
2
2
Number of Terminals
8
4
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
225 °C
225 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
2
Case Connection
SOURCE
Compare MRF8S19260HSR6 with alternatives
Compare MRF8S21200HSR6 with alternatives