MRF8S19260HSR6
vs
MRF6S19100NR1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
ROHS COMPLIANT, CASE 375J-02, NI-1230S-8, 8 PIN
FLATPACK, R-PDFP-F4
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
8541.29.00.75
Factory Lead Time
4 Weeks
Configuration
SEPARATE, 2 ELEMENTS
SINGLE
DS Breakdown Voltage-Min
65 V
68 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
L BAND
L BAND
JESD-30 Code
R-CQFP-F8
R-PDFP-F4
Number of Elements
2
1
Number of Terminals
8
4
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
225 °C
175 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
2
Pbfree Code
Part Package Code
TO-270
Pin Count
2
Manufacturer Package Code
CASE 1486-03
Case Connection
SOURCE
JEDEC-95 Code
TO-270
JESD-609 Code
e3
Moisture Sensitivity Level
3
Power Dissipation-Max (Abs)
287 W
Terminal Finish
Matte Tin (Sn)
Compare MRF8S19260HSR6 with alternatives
Compare MRF6S19100NR1 with alternatives