MRF6S19100NR1
vs
MRF19045R3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
TO-270
Package Description
FLATPACK, R-PDFP-F4
FLANGE MOUNT, R-CDFM-F2
Pin Count
2
2
Manufacturer Package Code
CASE 1486-03
CASE 465E-04
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
68 V
65 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
L BAND
L BAND
JEDEC-95 Code
TO-270
JESD-30 Code
R-PDFP-F4
R-CDFM-F2
JESD-609 Code
e3
Moisture Sensitivity Level
3
Number of Elements
1
1
Number of Terminals
4
2
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
175 °C
200 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLANGE MOUNT
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
287 W
105 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
Matte Tin (Sn)
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
3
Additional Feature
HIGH EFFICIENCY
Compare MRF6S19100NR1 with alternatives
Compare MRF19045R3 with alternatives