MRF7S19100NR1
vs
MRF19045LSR3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
FLANGE MOUNT, R-PDFM-F4
FLATPACK, R-CDFP-F2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
5A991
HTS Code
8541.29.00.75
8542.31.00.01
Factory Lead Time
4 Weeks
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
65 V
65 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
L BAND
L BAND
JEDEC-95 Code
TO-270
JESD-30 Code
R-PDFM-F4
R-CDFP-F2
JESD-609 Code
e3
e4
Moisture Sensitivity Level
3
Number of Elements
1
1
Number of Terminals
4
2
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
225 °C
200 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLATPACK
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
MATTE TIN
GOLD
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
Pin Count
2
Manufacturer Package Code
CASE 465F-04
Peak Reflow Temperature (Cel)
260
Power Dissipation-Max (Abs)
105 W
Time@Peak Reflow Temperature-Max (s)
40
Compare MRF7S19100NR1 with alternatives
Compare MRF19045LSR3 with alternatives