MRF6VP3450HSR6
vs
ARF1519
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Case Connection |
|
SOURCE
|
| Configuration |
|
SINGLE
|
| DS Breakdown Voltage-Min |
|
1000 V
|
| Drain Current-Max (ID) |
|
20 A
|
| FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
| Highest Frequency Band |
|
HIGH FREQUENCY BAND
|
| JESD-30 Code |
|
R-CDFM-F2
|
| JESD-609 Code |
|
e0
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Mode |
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
|
175 °C
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLANGE MOUNT
|
| Polarity/Channel Type |
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
|
1350 W
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
FLAT
|
| Terminal Position |
|
DUAL
|
| Transistor Application |
|
AMPLIFIER
|
| Transistor Element Material |
|
SILICON
|
|
|
|
Compare MRF6VP3450HSR6 with alternatives
Compare ARF1519 with alternatives