MRF6S23140HSR3
vs
MRF6S23100HSR3
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
,
|
FLATPACK, R-CDFP-F2
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
Base Number Matches |
2
|
3
|
Pin Count |
|
2
|
Manufacturer Package Code |
|
CASE 465A-06
|
HTS Code |
|
8541.29.00.75
|
Case Connection |
|
SOURCE
|
Configuration |
|
SINGLE
|
DS Breakdown Voltage-Min |
|
68 V
|
FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
Highest Frequency Band |
|
S BAND
|
JESD-30 Code |
|
R-CDFP-F2
|
Number of Elements |
|
1
|
Number of Terminals |
|
2
|
Operating Mode |
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
|
225 °C
|
Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
FLATPACK
|
Polarity/Channel Type |
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
|
330 W
|
Qualification Status |
|
Not Qualified
|
Surface Mount |
|
YES
|
Terminal Form |
|
FLAT
|
Terminal Position |
|
DUAL
|
Transistor Application |
|
AMPLIFIER
|
Transistor Element Material |
|
SILICON
|
|
|
|
Compare MRF6S23100HSR3 with alternatives