MRF6S23100HSR3
vs
MRF6S23100HR3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
,
FLANGE MOUNT, R-CDFM-F2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Factory Lead Time
4 Weeks
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Base Number Matches
3
2
Pin Count
2
Manufacturer Package Code
CASE 465-06
HTS Code
8541.29.00.75
Case Connection
SOURCE
Configuration
SINGLE
DS Breakdown Voltage-Min
68 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
S BAND
JESD-30 Code
R-CDFM-F2
Number of Elements
1
Number of Terminals
2
Operating Mode
ENHANCEMENT MODE
Operating Temperature-Max
225 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
Package Style
FLANGE MOUNT
Polarity/Channel Type
N-CHANNEL
Power Dissipation-Max (Abs)
330 W
Qualification Status
Not Qualified
Surface Mount
YES
Terminal Form
FLAT
Terminal Position
DUAL
Transistor Application
AMPLIFIER
Transistor Element Material
SILICON
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