MRF6S18060NBR1 vs MRF6S18060NR1 feature comparison

MRF6S18060NBR1 NXP Semiconductors

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MRF6S18060NR1 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description , ROHS COMPLIANT, PLASTIC, CASE 1486-03, WB-4, 4 PIN
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
JESD-609 Code e3 e3
Moisture Sensitivity Level 3 3
Peak Reflow Temperature (Cel) 260 260
Terminal Finish MATTE TIN Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40 40
Base Number Matches 1 1
HTS Code 8541.29.00.75
Case Connection SOURCE
Configuration SINGLE
DS Breakdown Voltage-Min 68 V
FET Technology METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band L BAND
JEDEC-95 Code TO-270
JESD-30 Code R-PDFP-F4
Number of Elements 1
Number of Terminals 4
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 225 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLATPACK
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 216 W
Qualification Status Not Qualified
Surface Mount YES
Terminal Form FLAT
Terminal Position DUAL
Transistor Application AMPLIFIER
Transistor Element Material SILICON

Compare MRF6S18060NBR1 with alternatives

Compare MRF6S18060NR1 with alternatives