MRF24WN0MB-I/RM100
vs
47L04-I/P
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
MODULE-37
|
DIP-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A992.C
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.32.00.51
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| JESD-30 Code |
R-XXMA-N37
|
R-PDIP-T8
|
| Length |
26.67 mm
|
9.271 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
37
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
IN-LINE
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
2.286 mm
|
5.334 mm
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
NO
|
| Telecom IC Type |
TELECOM CIRCUIT
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UNSPECIFIED
|
DUAL
|
| Width |
17.78 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
4 Weeks
|
| Date Of Intro |
|
2016-10-10
|
| Access Time-Max |
|
400 ns
|
| JESD-609 Code |
|
e3
|
| Memory Density |
|
4096 bit
|
| Memory IC Type |
|
MEMORY CIRCUIT
|
| Memory Width |
|
8
|
| Mixed Memory Type |
|
EEPROM+SRAM
|
| Number of Ports |
|
1
|
| Number of Words |
|
512 words
|
| Number of Words Code |
|
512
|
| Operating Mode |
|
SYNCHRONOUS
|
| Organization |
|
512X8
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP8,.3
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare MRF24WN0MB-I/RM100 with alternatives
Compare 47L04-I/P with alternatives